US Patent Issued to SAMSUNG ELECTRONICS on Nov. 18 for "Electronic device including housing containing metallic materials" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. RE50,667, issued on Nov. 18, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Seoul, South Korea).

"Electronic device including housing containing metallic materials" was invented by Byounghee Choi (Gyeonggi-do, South Korea), Yongwook Hwang (Gyeonggi-do, South Korea), Changyoun Hwang (Gyeonggi-do, South Korea), Jinho Lee (Gyeonggi-do, South Korea), Hyeonwoo Lee (Gyeonggi-do, South Korea), Youngsoo Jang (Gyeonggi-do, South Korea), Yunsung Ha (Gyeonggi-do, South Korea), Junghyeon Hwang (Gyeonggi-do, South Korea) and Minwoo Yoo (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Electronic device including first plate including first flat su...