US Patent Issued to SAMSUNG ELECTRONICS on Nov. 18 for "Electronic device and method for installing profile of embedded subscriber identity module in electronic device" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,320, issued on Nov. 18, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Electronic device and method for installing profile of embedded subscriber identity module in electronic device" was invented by Jieun Jung (Suwon-si, South Korea), Hyongjin Ban (Suwon-si, South Korea), Jaehyeon Seo (Suwon-si, South Korea), Jimin Park (Suwon-si, South Korea) and Yejin Yoon (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes at least one embedded universal integrated circuit card (eUICC) each storing at least one subscriber identification information, and at least one processor electrically co...