US Patent Issued to SAMSUNG ELECTRONICS on Nov. 18 for "Chemical mechanical polishing method and method for fabricating semiconductor device using the same" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,114, issued on Nov. 18, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Chemical mechanical polishing method and method for fabricating semiconductor device using the same" was invented by Yearin Byun (Suwon-si, South Korea), In Kwon Kim (Suwon-si, South Korea), Sang Kyun Kim (Suwon-si, South Korea) and Hyo San Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chemical mechanical polishing method may include polishing a polishing object at a first temperature using a chemical mechanical polishing slurry; and removing the chemical mechanical polishing slurry on the polishing object at a second tempe...