US Patent Issued to SAMSUNG ELECTRONICS on Nov. 11 for "Semiconductor substrate grinding apparatus for simultaneous grinding and polishing of backside of wafer" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,466,024, issued on Nov. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor substrate grinding apparatus for simultaneous grinding and polishing of backside of wafer" was invented by Donghoon Kwon (Suwon-si, South Korea) and Hyojung Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor substrate grinding apparatus including a chuck table configured to mount and fix a semiconductor substrate, so that a back side of the semiconductor substrate faces upwardly and rotates in one direction; a grinding wheel on the chuck table configured to grind the back side of the semiconductor substr...