US Patent Issued to SAMSUNG ELECTRONICS on Nov. 11 for "Semiconductor package including substrate having a dummy pattern between pads" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,775, issued on Nov. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including substrate having a dummy pattern between pads" was invented by Seunghun Chae (Sejong-si, South Korea), Youngkwan Seo (Hwaseong-si, South Korea), Jaeean Lee (Suwon-si, South Korea), Soyeon Moon (Suwon-si, South Korea), Hyeyeong Jo (Suwon-si, South Korea) and Iljong Seo (Seongnam-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a redistribution substrate having first and second surfaces, and an insulating member and a plurality of redistribution layers on different levels in the i...