ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,822, issued on Nov. 11, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Semiconductor package" was invented by Hwail Jin (Seongnam-si, South Korea) and Ji-Han Ko (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a lower semiconductor chip and semiconductor chips in a stack on the lower semiconductor chip in a first direction perpendicular to a top surface of the lower semiconductor chip. Connection bumps are between the lower semiconductor chip and a bottommost one of the semiconductor chips and between the semiconductor chips, A protection layer covers a lateral surface ...