ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,764, issued on Nov. 11, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-Do, South Korea).
"Semiconductor package" was invented by Eungchang Lee (Hanam-si, South Korea), Bangweon Lee (Yongin-si, South Korea), Jae Choon Kim (Incheon, South Korea) and Kyung Suk Oh (Seongnam-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including a substrate and at least one semiconductor chip on the substrate may be provided. The substrate may include a body layer having a top surface and a bottom surface, a first thermal conductive plate on the top surface of the body layer, the first thermal conductive plate connected t...