ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,810, issued on Nov. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Seongyo Kim (Asan-si, South Korea), Un-Byoung Kang (Hwaseong-Si, South Korea), Minsoo Kim (Gumi-si, South Korea), Sang-Sick Park (Hwaseong-si, South Korea) and Seungyoon Jung (Asan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package comprises a first die having a central region and a peripheral region that surrounds the central region; a plurality of through electrodes that penetrate the first die; a plurality of first pads at a top surface of the first die and coupled to the through...