US Patent Issued to SAMSUNG ELECTRONICS on Nov. 11 for "Semiconductor devices having a wiring provided with a protective layer" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,779, issued on Nov. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor devices having a wiring provided with a protective layer" was invented by Kyounghee Kim (Hwaseong-si, South Korea), Jinsub Kim (Seoul, South Korea), Munjun Kim (Suwon-si, South Korea) and Junkwan Kim (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a lower structure including a device and a lower wiring structure; an insulating layer on the lower structure; a via penetrating the insulating layer; a wiring pattern on the insulating layer and the via; and a silicon oxide layer covering the wiri...