ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,749, issued on Nov. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Method of manufacturing semiconductor package" was invented by Sang-Won Lee (Seoul, South Korea), Hyunki Kim (Asan-si, South Korea), Young-Ja Kim (Cheonan-si, South Korea) and Hyunggil Baek (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor package includes estimating an error in a solder ball attaching process, determining a specification of a ball tool and a method of the solder ball attaching process, based on the estimated error, manufacturing the ball tool according to the determined specifi...