ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,468,218, issued on Nov. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Method of fabricating semiconductor device" was invented by Heungsuk Oh (Bucheon-si, South Korea), Kyu-Bin Han (Incheon, South Korea) and Sangwook Kim (Yongin-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method of fabricating a semiconductor device using a curvilinear OPC method. The method of fabricating the semiconductor device includes performing an optical proximity correction (OPC) step on a layout to generate a correction pattern, the correction pattern having a curvilinear shape, performing a mask rule check (MRC) ste...