US Patent Issued to SAMSUNG ELECTRONICS on Nov. 11 for "Electronic device comprising camera module with a multi-layer ceramic condenser (MLCC) disposed in a hole in a metal plate under a rigid printed circuit board (RPCB)" (South Korean Inventor)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,470,799, issued on Nov. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Electronic device comprising camera module with a multi-layer ceramic condenser (MLCC) disposed in a hole in a metal plate under a rigid printed circuit board (RPCB)" was invented by Sewon Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A camera module according to an embodiment of the present disclosure may comprise: a rigid printed circuit board (RPCB), a metal plate coupled to the lower surface of the RPCB and having one or more holes formed therein, a multi-layer ceramic condenser (MLCC) disposed in the one or more holes in th...