US Patent Issued to SAMSUNG ELECTRONICS on Nov. 11 for "Core substrate, package structure including the core substrate, and method of manufacturing semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,793, issued on Nov. 11, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Core substrate, package structure including the core substrate, and method of manufacturing semiconductor package" was invented by Myeongho Hong (Suwon-si, South Korea), Dowon Kim (Anyang-si, South Korea), Jangbae Son (Incheon, South Korea), Seokwoo Yoon (Cheonan-si, South Korea) and Kyomuk Lim (Sejong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a core substrate including a substrate base including a plurality of first cavities and a plurality of second cavities, a plurality of blocks in the plurality of s...