ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,468,227, issued on Nov. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Apparatus and method for processing substrate" was invented by Ji Hoon Jeong (Seongnam-si, South Korea), Young-Hoo Kim (Yongin-si, South Korea), Sang Jine Park (Suwon-si, South Korea) and Ji Hwan Park (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for processing a substrate includes a process chamber; a support which is placed inside the process chamber and supports the substrate; a fluid supplier which supplies fluid into the process chamber; and a controller configured to perform a compressing step to bring the flui...