US Patent Issued to SAMSUNG ELECTRONICS on May 6 for "Semiconductor package including shielding cover that covers molded body" (South Korean Inventor)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,977, issued on May 6, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South Korea).

"Semiconductor package including shielding cover that covers molded body" was invented by Young-Woo Park (Cheonan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of fabricating a semiconductor package includes mounting at least one semiconductor chip to a package substrate, forming a shielding wall around the at least one semiconductor chip, forming a molded body on the package substrate in a space surrounded by the shielding wall, and forming a shielding cover covering the molding unit and in contact with the shielding wall."

The patent was fi...