US Patent Issued to SAMSUNG ELECTRONICS on May 27 for "Structure for applying millimeter wave antenna module to foldable electronic device" (South Korean Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,316,796, issued on May 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Structure for applying millimeter wave antenna module to foldable electronic device" was invented by Joon Heo (Suwon-si, South Korea), Sungsoo Kim (Suwon-si, South Korea) and Seyoon Bae (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device is provided. The electronic device includes a first housing, a second housing coupled to the first housing through a hinge structure to be rotatable about a first axis that faces a first direction, a first cover covering a rear surface of the first housing, a second cover covering a re...