US Patent Issued to SAMSUNG ELECTRONICS on May 27 for "Semiconductor packages having connecting structure" (South Korean Inventor)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,832, issued on May 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor packages having connecting structure" was invented by Kijong Park (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a substrate including an upper pad at a top surface of the substrate, a semiconductor chip on the substrate and including a chip pad at a top surface of the semiconductor chip, a connecting structure on the semiconductor chip and including a connecting pad at a top surface of the connecting structure and electrically connected to the upper pad, an encapsulant covering the su...