US Patent Issued to SAMSUNG ELECTRONICS on May 27 for "Semiconductor chip with fuse structure in scribe lane and method of fabricating the same" (South Korean Inventor)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,800, issued on May 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor chip with fuse structure in scribe lane and method of fabricating the same" was invented by Donghwa Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a method of designing and fabricating a semiconductor chip including a fuse cell. The method may include preparing a semiconductor chip layout, the semiconductor chip layout including a main chip layout and a scribe lane layout enclosing the main chip layout; disposing a fuse layout in the scribe lane layout; setting the main chip layout as a first data pre...