US Patent Issued to SAMSUNG ELECTRONICS on May 27 for "Methods of manufacturing a fan-out panel level semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,822, issued on May 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (South Korea).

"Methods of manufacturing a fan-out panel level semiconductor package" was invented by Jeongho Lee (Suwon-si, South Korea) and Doohwan Lee (Cheonan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a frame structure having a core portion and a lower pad under the core portion. A cavity penetrates the core portion, and a semiconductor chip is arranged in the cavity and has an active surface on which a bump pad is arranged and a non-active surface facing the active surface. A redistribution structure is positioned under the ...