US Patent Issued to SAMSUNG ELECTRONICS on May 27 for "Method and apparatus for performing header compression in a wireless system" (British Inventor)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,130, issued on May 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Method and apparatus for performing header compression in a wireless system" was invented by Mahmoud Watfa (Staines, Great Britain).

According to the abstract* released by the U.S. Patent & Trademark Office: "In accordance an embodiment of the disclosure, a method performed by a user equipment (UE) in a wireless communication system is provided. The method may comprise: identifying an inter-system change from a first mode to a second mode, transferring a data session established in the first mode to the second mode from the first mode, determining whether the UE and a network entity in t...