US Patent Issued to SAMSUNG ELECTRONICS on May 27 for "Interconnection structure of a semiconductor chip having pads of different widths and semiconductor package including the interconnection structure" (South Korean Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,818, issued on May 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Interconnection structure of a semiconductor chip having pads of different widths and semiconductor package including the interconnection structure" was invented by Keumhee Ma (Suwon-si, South Korea) and Chulyong Jang (Anyang-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interconnection structure of a semiconductor chip may include an interconnection via, a lower pad, a conductive bump, and an upper pad. The interconnection via may be arranged in the semiconductor chip. The lower pad may be arranged on a lower end of the interconnection ...