US Patent Issued to SAMSUNG ELECTRONICS on May 27 for "Integrated circuit devices including a metal resistor and methods of forming the same" (New York Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,582, issued on May 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Integrated circuit devices including a metal resistor and methods of forming the same" was invented by Byounghak Hong (Albany, N.Y.), Hoonseok Seo (Albany, N.Y.), Seungchan Yun (Waterford, N.Y.), Inchan Hwang (Schenectady, N.Y.) and Kang-ill Seo (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit devices including a metal resistor and methods of forming the same are provided. The integrated circuit devices may include a substrate including a first surface and a second surface that is opposite the first surface and is parallel to ...