US Patent Issued to SAMSUNG ELECTRONICS on May 27 for "Electronic device including printed circuit board structure including thermal interface material" (South Korean Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,407, issued on May 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Gyeonggi-Do, South Korea).

"Electronic device including printed circuit board structure including thermal interface material" was invented by Kyuhwan Lee (Suwon-si, South Korea), Min Park (Suwon-si, South Korea), Haejin Lee (Suwon-si, South Korea), Jaeheung Ye (Suwon-si, South Korea) and Yeonkyung Chung (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes a printed circuit board ("PCB") structure which accommodates a thermal interface material ("TIM"). The PCB structure includes a base plate, a first component on the base plate, a seco...