ALEXANDRIA, Va., June 17 -- United States Patent no. 12,310,471, issued on May 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Electronic device cover" was invented by Wonseuk Lee (Suwon-si, South Korea), Heesuk Wang (Suwon-si, South Korea), Namhyun Kang (Suwon-si, South Korea), Minah Koh (Suwon-si, South Korea), Hakdo Kim (Suwon-si, South Korea) and Sol Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "According to an embodiment of the present invention, an electronic device cover includes: a first plate that can be attached/detached to/from one surface of the electronic device; a second plate overlappingly coupled to the first plate; and a third plate whic...