US Patent Issued to SAMSUNG ELECTRONICS on May 27 for "Connecting assembly comprising flexible printed circuit board and electronic device including the same" (South Korean Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,418, issued on May 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Connecting assembly comprising flexible printed circuit board and electronic device including the same" was invented by Wonho Lee (Suwon-si, South Korea), Hyunggwang Kang (Suwon-si, South Korea), Junhyuk Kim (Suwon-si, South Korea), Hyunsuk Kim (Suwon-si, South Korea), Sanghyuk Park (Suwon-si, South Korea), Joongyeon Cho (Suwon-si, South Korea), Nakhyun Choi (Suwon-si, South Korea), Myunghoon Kwak (Suwon-si, South Korea), Yangwook Kim (Suwon-si, South Korea), Soyoung Lee (Suwon-si, South Korea) and Jookwan Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Paten...