ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,363, issued on May 20, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-Do, South Korea).
"Semiconductor package" was invented by Manho Lee (Hwaseong-si, South Korea), Eunseok Song (Hwaseong-si, South Korea), Keung Beum Kim (Hwaseong-si, South Korea), Kyung Suk Oh (Seongnam-si, South Korea) and Eon Soo Jang (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including a first semiconductor chip including a logic structure and a second semiconductor chip bonded to the first semiconductor chip may be provided. The first semiconductor chip may include signal lines on a first surface of a first semicond...