US Patent Issued to SAMSUNG ELECTRONICS on May 20 for "Semiconductor device including element isolation film and method for fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,310,004, issued on May 20, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor device including element isolation film and method for fabricating the same" was invented by Tae Jin Park (Yongin-si, South Korea), Gyul Go (Seoul, South Korea), Jun Soo Kim (Seongnam-si, South Korea), Gyung Hyun Yoon (Hwaseong-si, South Korea), Eui Jun Cha (Seoul, South Korea), Hui-Jung Kim (Seongnam-si, South Korea) and Yoo Sang Hwang (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and a method for fabricating the same is provided. The semiconductor device includes a lower semiconductor film, ...