US Patent Issued to SAMSUNG ELECTRONICS on May 20 for "Semiconductor device and method of fabricating same" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,310,095, issued on May 20, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South Korea).

"Semiconductor device and method of fabricating same" was invented by Jongchan Shin (Gwacheon-si, South Korea) and Changmin Park (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes; a substrate including a first region and a second region adjacent to the first region in a first direction, a pair of active patterns adjacently disposed on the substrate, wherein the pair of active patterns includes a first active pattern extending in the first direction and a second active pattern extending in parallel with the first a...