US Patent Issued to SAMSUNG ELECTRONICS on May 20 for "Method and apparatus for supporting network slice in wireless communication system" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,309,689, issued on May 20, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Method and apparatus for supporting network slice in wireless communication system" was invented by Hoyeon Lee (Suwon-si, South Korea), Youngsung Kho (Suwon-si, South Korea) and Sangsoo Jeong (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure relates to a 5G or 6G communication system for supporting a higher data transmission rate. A method and an apparatus for efficiently providing network slicing in a wireless communication system or a mobile communication system are provided."

The patent was filed on Feb. 15, 2022, unde...