US Patent Issued to SAMSUNG ELECTRONICS on May 13 for "Three-dimensional semiconductor memory devices, methods of fabricating the same, and electronic systems including the same" (South Korean Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,302,563, issued on May 13, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South Korea).

"Three-dimensional semiconductor memory devices, methods of fabricating the same, and electronic systems including the same" was invented by Donghwan Kim (Seoul, South Korea), Shinhwan Kang (Suwon-si, South Korea), Youngji Noh (Suwon-si, South Korea), Jung-Hwan Park (Suwon-si, South Korea) and Sanghun Chun (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are three-dimensional semiconductor memory devices, electronic systems including the same, and methods of fabricating the same. The three-dimensional semiconductor memory device includes...