ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,671, issued on May 13, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Semiconductor packages and methods of manufacturing the semiconductor packages" was invented by Eunsuk Jung (Hwaseong-si, South Korea), Hyoukyung Cho (Seoul, South Korea), Jinnam Kim (Anyang-si, South Korea), Hyungjun Jeon (Seoul, South Korea), Kwangjin Moon (Hwaseong-si, South Korea), Hoonjoo Na (Seoul, South Korea) and Hakseung Lee (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes first to fourth semiconductor chips sequentially stacked on one another. A backside of a third substrate of the third semicondu...