US Patent Issued to SAMSUNG ELECTRONICS on May 13 for "Semiconductor package including outer conductive plate" (South Korean Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,625, issued on May 13, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including outer conductive plate" was invented by Minjung Kim (Cheonan-si, South Korea), Dongkyu Kim (Anyang-si, South Korea), Jongyoun Kim (Seoul, South Korea), Seokhyun Lee (Hwaseong-si, South Korea) and Jaegwon Jang (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a substrate; and a first semiconductor device and a second semiconductor device that are provided on the substrate. The substrate includes a first dielectric layer and a second dielectric layer provided on the first ...