US Patent Issued to SAMSUNG ELECTRONICS on May 13 for "Semiconductor package and method of fabricating the same" (South Korean Inventor)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,667, issued on May 13, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method of fabricating the same" was invented by YeongBeom Ko (Cheonan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor package, including a lower semiconductor chip, a plurality of semiconductor chips that are disposed on the lower semiconductor chip in a first direction perpendicular to a top surface of the lower semiconductor chip, a plurality of nonconductive layers disposed between the plurality of semiconductor chips, a nonconductive pattern that extends from the nonconductive layers a...