ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,589, issued on May 13, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).
"Semiconductor package" was invented by Gwangjae Jeon (Hwaseong-si, South Korea), Jung-Ho Park (Cheonan-si, South Korea), Seokhyun Lee (Hwaseong-si, South Korea) and Yaejung Yoon (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are semiconductor packages and methods of fabricating the same. The semiconductor package comprises a first redistribution substrate and a first semiconductor device on the first redistribution substrate. The first redistribution substrate includes a first dielectric layer that includes a first hole...