ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,665, issued on May 13, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Jang-woo Lee (Asan-si, South Korea), Un-byoung Kang (Hwaseong-si, South Korea), Ji-hwang Kim (Cheonan-si, South Korea), Jong-bo Shim (Asan-si, South Korea) and Young-kun Jee (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first package substrate, a first semiconductor chip on the first package substrate, a plurality of first chip connection units to connect the first package substrate to the first semiconductor chip, an interposer on the first semiconductor chi...