ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,649, issued on May 13, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Yong Ho Kim (Hwaseong-si, South Korea), Bo In Noh (Suwon-si, South Korea) and Jeong Hoon Ahn (Seongnam-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package is provided. The semiconductor package includes: a first stack including a first semiconductor substrate; a through via that penetrates the first semiconductor substrate in a first direction; a second stack that includes a second face facing a first face of the first stack, on the first stack; a first pad that is in contact with the...