ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,675, issued on May 13, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Jiyoung Park (Asan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor package including a redistribution substrate, a semiconductor chip on a top surface of the redistribution substrate, a first passive device and a second passive device on a bottom surface of the redistribution substrate and spaced apart, connection terminals on the bottom surface of the redistribution substrate, and an underfill layer between the first passive device and the redistribution substrate and between...