US Patent Issued to SAMSUNG ELECTRONICS on May 13 for "Semiconductor devices having supporter structures" (South Korean Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,730, issued on May 13, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor devices having supporter structures" was invented by Hoin Lee (Hwaseong-si, South Korea) and Kiseok Lee (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes lower electrodes, a first supporter structure including first supporter patterns interconnecting the lower electrodes, wherein side surfaces of the first supporter patterns and side surfaces of the lower electrodes that are exposed by the first supporter patterns at least partially define a first open region, the first supporter patter...