ALEXANDRIA, Va., June 12 -- United States Patent no. 12,302,556, issued on May 13, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor device and method of fabricating the same" was invented by Dong-Wan Kim (Hwaseong-si, South Korea), Keonhee Park (Suwon-si, South Korea), Dong-Sik Park (Suwon-si, South Korea), Joonsuk Park (Suwon-si, South Korea), Jihoon Chang (Yongin-si, South Korea) and Hyeon-Woo Jang (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are semiconductor devices and their fabrication methods. The semiconductor device comprises a substrate including a peripheral block and cell blocks each including a cell center region, a cell e...