US Patent Issued to SAMSUNG ELECTRONICS on May 13 for "Method of manufacturing semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,509, issued on May 13, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Method of manufacturing semiconductor package" was invented by Junyong Chung (Sejong-si, South Korea) and Wooseup Hwang (Daegu, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor package, the method including providing a first seed layer on an insulation layer such that the first seed layer includes a first metal material; providing a second seed layer on the first seed layer such that the second seed layer includes a second metal material different from the first metal material; forming photoresist patterns...