ALEXANDRIA, Va., June 12 -- United States Patent no. 12,299,368, issued on May 13, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Method of manufacturing a semiconductor device" was invented by Akio Misaka (Hwaseong-si, South Korea), Jongdoo Kim (Yongin-si, South Korea) and Noyoung Chung (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device is disclosed. The method includes generating a first virtual layout by placing and routing standard cells using a virtual netlist, searching first duplicate pattern regions in the first virtual layout and choosing one of them as a first representative pattern region, performing an ...