US Patent Issued to SAMSUNG ELECTRONICS on May 13 for "Interposer structure and an electronic device including the same" (South Korean Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,302,495, issued on May 13, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Interposer structure and an electronic device including the same" was invented by Yeonkyung Chung (Suwon-si, South Korea), Jichul Kim (Suwon-si, South Korea), Jinyong Park (Suwon-si, South Korea) and Gyeongmin Jin (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to an embodiment, an electronic device may include a first printed circuit board (PCB), a second PCB having a shape corresponding to the first PCB, and an interposer surrounding a space between the first PCB and the second PCB and including multiple pads, wherein the i...