US Patent Issued to SAMSUNG ELECTRONICS on May 13 for "Fan-out semiconductor package and electronic device including the same" (South Korean Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,594, issued on May 13, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Fan-out semiconductor package and electronic device including the same" was invented by Sun Ho Kim (Suwon-si, South Korea), Ji Hoon Kim (Suwon-si, South Korea), Ha Young Ahn (Suwon-si, South Korea), Shang Hoon Seo (Suwon-si, South Korea), Seung Yeop Kook (Suwon-si, South Korea) and Sung Won Jeong (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A fan-out semiconductor package includes: an interconnection member including a first insulating layer, first and second pads respectively disposed on opposite sides of the first insulating layer...