US Patent Issued to SAMSUNG ELECTRONICS on March 4 for "Cover laminated with multilayer film, electronic device including the same, and method for manufacturing multilayer film" (South Korean Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,245,392, issued on March 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Cover laminated with multilayer film, electronic device including the same, and method for manufacturing multilayer film" was invented by Jeamoon Jung (Suwon-si, South Korea), Jayeun Ko (Suwon-si, South Korea), Hokyung Moon (Suwon-si, South Korea) and Taehyun Song (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is an electronic device including a cover defining a portion of an external appearance of the electronic device, a film layer attached to a first surface of the cover, at least one UV molding pattern layer disposed on...