US Patent Issued to SAMSUNG ELECTRONICS on March 4 for "Bonding wire, semiconductor package including the same, and wire bonding method" (South Korean Inventor)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,846, issued on March 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Bonding wire, semiconductor package including the same, and wire bonding method" was invented by Keun-ho Choi (Anyang-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding wire for connecting a first pad to a second pad is provided. The bonding wire includes a ball part bonded to the first pad, a neck part formed on the ball part, and a wire part extending from the neck part to the second pad. Less than an entire portion of a top surface of the neck part is covered by the wire part, and the wire part is in contact with the neck part, the...