US Patent Issued to SAMSUNG ELECTRONICS on March 25 for "Semiconductor packages including antenna pattern" (South Korean Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,135, issued on March 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor packages including antenna pattern" was invented by Se Ho You (Seoul, South Korea), Hyeong Seob Kim (Cheonan-si, South Korea) and Seung Kon Mok (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package having a thinner shape and including an antenna is provided. A semiconductor package comprises a first substrate, a second substrate on the first substrate and including a first face facing the first substrate and a second face opposite to the first face, a pillar extending from the second face of the secon...