US Patent Issued to SAMSUNG ELECTRONICS on March 25 for "Semiconductor packages having a dam structure" (South Korean Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,093, issued on March 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor packages having a dam structure" was invented by Dongho Kim (Asan-si, South Korea), Jongbo Shim (Asan-si, South Korea), Hwanpil Park (Hwaseong-si, South Korea) and Jangwoo Lee (Asan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package is disclosed. The disclosed semiconductor package includes a substrate having bonding pads at an upper surface thereof, a lower semiconductor chip, at least one upper semiconductor chip disposed on the lower semiconductor chip, and a dam structure having a closed loop shape su...