US Patent Issued to SAMSUNG ELECTRONICS on March 25 for "Semiconductor package including redistribution substrate and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,107, issued on March 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor package including redistribution substrate and method of manufacturing the same" was invented by Moongil Jung (Asan-si, South Korea), Suhyeon Ku (Asan-si, South Korea), Soyoen Park (Cheonan-si, South Korea) and Kyungsub Kim (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a semiconductor chip; and a redistribution substrate connected to the semiconductor chip, the redistribution structure including a conductive structure including a lower conductive pattern and a redistribution str...