US Patent Issued to SAMSUNG ELECTRONICS on March 25 for "Semiconductor package including image sensor chip, transparent substrate, and joining structure" (South Korean Inventor)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,181, issued on March 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (South Korea).

"Semiconductor package including image sensor chip, transparent substrate, and joining structure" was invented by Woonbae Kim (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package may include an image sensor chip, a transparent substrate spaced apart from the image sensor chip, a joining structure in contact with a top surface of the image sensor chip and a bottom surface of the transparent substrate, on an edge region of the top surface of the image sensor chip, and a circuit substrate electrically connected to the image sensor...