US Patent Issued to SAMSUNG ELECTRONICS on March 25 for "Semiconductor package and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,104, issued on March 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method of fabricating the same" was invented by Hyeonjeong Hwang (Cheonan-si, South Korea), Dongkyu Kim (Anyang-si, South Korea), Minjung Kim (Cheonan-si, South Korea) and Yeonho Jang (Cheonan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including a redistribution substrate extending in a first direction and a second direction perpendicular to the first direction, a semiconductor chip mounted on a top surface of the redistribution substrate, and an outer terminal on a bottom surface of t...